Splitting the Die - A Modular Approach to Chiplet Design and Verification

Explore the transition from monolithic SoCs to modular chiplet architectures in this 18-minute conference talk that addresses the growing demand for scalable, modular silicon driven by AI applications. Learn about the challenges of adapting traditional system-on-chip designs to multi-die systems and discover the standardization requirements necessary for creating interoperable chiplets that can be reused across different vendor systems. Examine the design, verification, and system integration standards essential for reliable multi-vendor chiplet composition, and gain insights into how these standards enable the development of a viable chiplet marketplace. Discover the Arm Chiplet System Architecture specification, which provides a framework for cleanly partitioning Arm-based systems across dies using standard interfaces and protocols. Understand how this composable approach to silicon design aligns with next-generation AI system requirements and accelerates the creation of an open, reusable chiplet ecosystem that supports modular hardware development across the industry.