Universal Die to Die Chiplet Interfacing Standards - The Road to Interoperability

Learn about universal die-to-die chiplet interfacing standards and the path toward achieving multi-vendor interoperability in this conference talk by Jeff Maguire, Director of Product Management at Ventana Micro Systems. Explore the semiconductor industry's recognition of chiplet integration benefits while addressing the primary challenge of multi-vendor chiplet interoperability that hinders widespread adoption. Discover Ventana's contribution of the "ODSA D2D Transaction and Link Layer (TLL) Specification for BoW Interfaces" and understand how UCIe has gained market traction despite leaving protocol interoperability out-of-scope beyond PCIe and CXL protocols. Examine Ventana's latest OCP contribution on TTL binding to the UCIe Flit-Aware Die-to-Die Interface (FDI) and delve into various protocol mappings, particularly AMBA protocols, to the TLL interfacing layer. Gain insights into the strategic vision for creating an extensive ecosystem of interoperable chiplets within the OCP Chiplet Marketplace designed to serve diverse applications and market segment requirements, with opportunities to contribute to defining and refining protocol mappings for ultra-low latency chiplet integration strategies.