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Watch a 25-minute conference presentation from the SNIA Compute, Memory, and Storage Summit exploring the Universal Chiplet Interconnect Express (UCIe) open specification and its role in enabling an open chiplet ecosystem. Discover the key features introduced in the UCIe 1.1 specification, including die-to-die I/O physical layer, protocols, and software stack that build upon established PCI Express and Compute Express Link standards. Learn how UCIe addresses industry demands for customizable package-level integration and facilitates interoperable, multi-vendor ecosystem connections through best-in-class die-to-die interconnects. Presented by industry experts Brian Rea from UCI Express and Richelle Ahlvers from SNIA, gain valuable insights into the future of chiplet technology and package-level integration.
