Process and Fabrication Technology

Week 1: Introduction to Semiconductor Manufacturing Technology

• Introduction to VLSI Design

• Introduction to Conventional Device structures – PN junction diode, Bipolar Junction Transistor and MOSFET

• Preparation of Electronic grade silicon

• Crystal growth and Wafer preparation

• Introduction to Silicon Crystal Structure and Defects

Week 2: Oxidation and Diffusion

• Oxidation and types of oxidation process

• Oxidation Systems and Factors affecting oxidation process

• Introduction to Diffusion process and Diffusion Mechanisms

• Diffusion Systems and Limitations

• Doping using Solid-State Diffusion

Week 3: Ion Implantation

• Introduction to Ion Implantation

• Doping using Ion Implantation

• Ion Implantation Systems

• Theory of Ion Implantation

• Pros and Cons of Ion Implantation

Week 4: Lithography Process

• Introduction to Lithography

• Optical or Photo-Lithography Process Steps

• Different Techniques used in Optical Lithography Process

• Limitations in Optical Lithography

• Other Lithography Techniques

• Electron Beam Lithography and X-ray Lithography

• Comparison of Optical, Electron and X-ray Lithography

Week 5: Etching Process

• Introduction to Etching Technique

• Significance of Etching process in Lithography

• Figures of Merits in Etching Process

• Comparison of Wet etching and Dry Etching

• Process Steps in Wet etching; Wet etching of Silicon – An Example

• Limitations in Wet Etching

• Dry Etching; Introduction to Plasma; Dry Etching Mechanisms

Week 6: Thin Film Deposition

• Relative Particle Size and Transistor Scaling

• Impact of External Particles on Nano-scale devices/Miniaturized Systems

• Introduction to Vacuum Environment

• Classification – Thin Film Deposition Techniques

• Physical Vapor Deposition (PVD) – Requirements, Techniques and Limitations

• Chemical Vapor Deposition (CVD) – Requirements, Techniques and Limitations

• Epitaxy Technique – Deposition of Single Crystalline Structure

Week 7: Metallization and Packaging

• Primary requirements of Interconnects

• Steps in formation of Interconnects

• Vias and Multilevel Metallization for a Metal Interconnect System

• Electromigration – Reliability Problem in Interconnects

• Alternative Interconnect Metals to supress Electromigration

• Damascene process

• Chemical-Mechanical Polishing

• Packaging of VLSI Devices – Introduction, Types and Technologies

• Testing, Assembly and Qualification of Wafers

Week 8: Conventional Device Fabrication

• Fabrication of Simple PN junction diode

• CMOS Fabrication Process (n-well/p-well/twin well)

• BJT Fabrication Process

• Bi-CMOS Fabrication Process

• Technology Challenges in Conventional Transistors (BJT and MOSFETs)

• Device Engineering - Techniques to overcome technology Challenges

• FinFET – Modern Transistor Fabrication Process

• Summary