Learn how to overcome AI scale-up limitations through innovative co-packaged mixed-media interconnect architecture in this 22-minute conference talk. Explore the constraints imposed by passive copper interconnects at 200 Gbps per lane and higher data rates, and discover how co-packaged copper (CPC) sockets can support both passive and active copper connections alongside co-packaged optics modules. Understand the flexible CPX (co-packaged mixed-media) interconnect architecture that eliminates traditional reach limitations, enabling operators to extend AI scale-up domains across entire data centers while maintaining operational simplicity. Gain insights into the benefits of a multi-vendor, pluggable CPX ecosystem and how this approach addresses critical operational barriers in AI infrastructure deployment.