Empowering Scale Up and Scale Out Networking with Samtec CPX Architecture - CPC CPO

Learn about next-generation datacenter interconnect solutions through this 14-minute conference presentation that explores Samtec's CPX architecture for Co-Packaged Copper (CPC) and Co-Packaged Optics (CPO) technologies. Discover how CPC extends 224 Gbps signaling by eliminating BGA packaging losses, enabling approximately 1.5-meter DAC reach while preserving copper interconnect viability for GPU clustering applications. Explore emerging CPO solutions that provide high-bandwidth, low-latency optical links capable of spanning multiple racks in modern datacenters. Examine the unified CPX connector architecture that supports both CPC and CPO implementations, breaking through existing performance barriers to enable seamless multi-GPU interconnection and AI supercomputing fabric deployment. Gain insights into how these advanced interconnect technologies address the growing complexity and performance demands of next-generation datacenter and AI-ML workloads from Samtec's technical experts.