Addressing Future Thermal Challenges Driven by AI - Data Center Cooling Solutions
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Learn about GPU evolution and power management challenges in AI computing through this 24-minute conference talk from Lenovo at the Open Compute Project. Explore the transformation from theoretical concepts to practical applications in thermal management, including detailed insights into Cold Plate Design, QD and Manifold implementations, and Facility Standards. Discover Lenovo's history of thermal innovation, current trends in liquid cooling, and critical challenges facing AI deployment at both rack and room levels. Gain valuable understanding of where thermal management is heading and what factors are most crucial for addressing future AI-driven thermal challenges.
Syllabus
Introduction
Challenges of AI
Challenges of deploying AI
Lenovos history of thermal innovation
Liquid cooling trends
Liquid cooling challenges
Where the J is going
What matters
Challenges
Outro
Taught by
Open Compute Project