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Learn about advanced cold plate design solutions for E1.S modules in liquid-cooled data centers through this 21-minute conference talk from the Open Compute Project. Discover how Microsoft and Wiwynn collaborated to overcome the thermal and mechanical challenges posed by E1.S modules' slim profile and dense layout. Explore the specialized internal flow channel design that ensures even cooling distribution and examine the innovative elastic interface mechanism that reduces shear stress on thermal interface material (TIM) pads during module swaps. Understand how abrasion-resistant TIM materials and modular construction approaches enhance reliability, improve cooling efficiency, and simplify maintenance procedures for next-generation storage systems. Gain insights into maintaining form factor compatibility while integrating critical thermal management components for high-performance data center applications.
