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Explore IBM Research's groundbreaking polymer optical waveguide technology through a comprehensive lab tour that demonstrates the testing methodologies for revolutionary co-packaged optics modules. Follow IBM Distinguished Engineer John Knickerbocker as he guides you through the Yorktown Heights laboratory, explaining how this cutting-edge technology could replace electrical interconnects in computer centers to dramatically accelerate AI model training and other computing applications while significantly reducing energy consumption. Learn about the four critical testing phases: component inspection using advanced microscopy and measurement techniques, package assembly processes that integrate optical and electrical components, rigorous stress-testing procedures that simulate real-world operating conditions, and comprehensive quality testing protocols that ensure optimal performance. Discover the techniques used to increase bandwidth capacity and understand how co-packaged optics represents a major advancement in chip assembly and packaging technology. Gain insights into the challenges of testing completely novel technologies and the methodologies required to validate performance specifications for components that have never existed before, providing a unique behind-the-scenes look at how IBM Research approaches innovation in optical computing infrastructure.
