How Will Copper Drive High Speed Interconnect Solutions Fueling Next Generation AI Data Centers

Learn how copper interconnect solutions are evolving to meet the demanding performance requirements of next-generation AI data centers in this 14-minute conference talk from the Open Compute Project. Explore various approaches for achieving 448G data rates, including bandwidth extension techniques and modified coding schemes, while understanding their impact on cable characterization processes. Discover innovative solutions for ultra-small cables down to 39 AWG specifically designed for CPC (Chip-to-Package-to-Chip) applications. Examine emerging requirements for AI data center interconnects, including materials compliance standards and deployment capabilities in challenging environments such as space applications. Gain insights into addressing these technical challenges and see demonstrations of space-ready high-speed cable solutions that push the boundaries of copper interconnect technology for high-performance computing environments.