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Explore cutting-edge developments in chiplet design through this 19-minute conference presentation from the Open Compute Project. Learn about CDX's latest contributions to advancing chiplet technology, focusing on both standardization efforts and practical implementation strategies. Discover key updates to the CDXML specification, including newly added support for Assembly Design Kits (ADK), Material Design Kits (MDK), and Test Design Kits (TDK) that enable comprehensive digital twin frameworks for chiplet-based systems. Examine the CDX demonstration design showcasing a high-performance architecture that integrates HBM and UCIe-connected chiplets on a glass interposer. Understand how this work validates essential workflows for early planning, co-design, and system integration in next-generation heterogeneous packaging solutions. Gain insights from industry experts including a PhD student from Georgia Institute of Technology and CEOs from Anemoi Software Inc and Palo Alto Electron as they present practical approaches to chiplet standardization and system realization.
