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Learn about the BoW Memory Addendum to the BoW PHY 2.0 Specification in this 28-minute conference talk from the Open Compute Project. Explore how die-to-die (D2D) interfaces like Bunch of Wires (BoW) address the Memory Wall problem, where compute performance increases have significantly outpaced memory bandwidth improvements over the past two decades. Discover the optional enhancements detailed in this new OCP contribution that enable more efficient ASIC-to-memory device chiplet connections, delivering improved performance at lower power consumption compared to traditional off-package memory interfaces. Gain insights into how these BoW enhancements are designed to overcome system performance limitations caused by the growing disparity between computational capabilities and memory access speeds, and understand the technical specifications that will be published before OCP Global Summit 2025.
