High-Speed Interconnect Signal Integrity in Immersion Cooling Technology

Learn about the critical challenges and solutions for maintaining high-speed signal integrity in immersion cooling environments through this 15-minute conference presentation. Explore how dielectric cooling fluids impact high-speed signal transmission, examining key factors including dielectric constant changes, crosstalk effects, attenuation issues, and material compatibility concerns. Discover strategies for mitigating signal degradation through optimized connector design considerations, strategic material selection, and advanced signal conditioning techniques. Gain insights from industry experts Terry Little from Foxconn Interconnect Technology and Kai Wang from Intel as they present findings from an Immersion Technology White Paper, addressing the evolving thermal management needs of modern data centers and high-performance computing applications.