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IRIS: Non-Destructive Inspection of Silicon

media.ccc.de via YouTube

Overview

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Learn about IRIS (Infra-Red, in situ), an innovative technique for non-destructively examining chip construction, in this 58-minute conference talk from the 38th Chaos Communication Congress. Discover how this method enables visualization of micron-scale features within chip-scale packages using modified off-the-shelf microscope cameras, without requiring desoldering or expensive analytical equipment. Explore the theoretical foundations of IRIS, its practical applications, and its significance in addressing hardware supply chain security concerns. Understand how this democratized inspection technique can provide supporting evidence of correct chip construction while considering various threat scenarios and limitations. Follow along as Andrew 'bunnie' Huang demonstrates the technique's implementation using a Jubilee 3D motion platform for detailed full-chip imaging and shows real-time examples using common mobile phone motherboards. Gain insights into how IRIS can serve as a valuable tool for system designers focused on enabling user-level hardware verification, making chip inspection more accessible to the broader community.

Syllabus

38C3 - IRIS: Non-Destructive Inspection of Silicon

Taught by

media.ccc.de

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