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Explore the transformative potential of next-generation computing architectures in this conference talk that addresses the critical limitations of current computing systems facing 21st-century abundant-data workloads like AI and Machine Learning. Discover how the "memory wall" problem—where systems waste enormous time and energy shuttling data between processors and off-chip memory—becomes increasingly severe as conventional 2D miniaturization reaches its limits. Learn about the revolutionary N3XT 3D approach that creates new chip architectures through ultra-dense 3D integration of logic and memory, effectively co-locating computation and storage on single chips. Understand how multiple N3XT 3D chips integrate through the N3XT 3D MOSAIC system using chip stacking, interposer, and wafer-level integration techniques. Examine how Illusion systems orchestrate workload execution across N3XT 3D MOSAIC configurations to create the illusion of a "Dream Chip" with near-optimal energy efficiency and throughput. Review hardware prototypes developed in industrial facilities through lab-to-fab activities that demonstrate the approach's effectiveness, targeting 1,000X improvements in system-level Energy-Delay-Product benefits. Investigate new methodologies for ensuring robust system operation despite growing challenges from design bugs, manufacturing defects, reliability failures, and security attacks in these advanced computing architectures.
