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Explore advanced Co-packaged Optics (CPO) technology integrated with CoWoS and COUPE packaging solutions in this 13-minute keynote presentation from the 2025 OCP APAC Summit. Learn about the rationale behind implementing CPO technology based on CoWoS, which is widely utilized for high-performance network switches and AI accelerators. Discover how these packaging innovations drive high-bandwidth, energy-efficient data connectivity solutions. Gain insights into the current development status of CPO technology, understand the technical challenges facing the industry, and examine future advancements in CPO packaging technology from TSMC's perspective on next-generation semiconductor packaging solutions.
