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Explore how advanced packaging creativity is propelling AI forward in this keynote presentation from the 2025 OCP APAC Summit. Discover the semiconductor industry's groundbreaking innovations that integrate intelligence into generative, agentic, and physical AI models spanning from cloud to edge computing. Learn about the critical challenges facing data centers, particularly power and cooling demands, as they house the infrastructure pushing performance boundaries. Understand how heterogeneous integration through advanced packaging plays a pivotal role in pushing physical, electrical, and thermal limits to achieve better energy efficiency and greater compute power. Examine the AI and data center landscape while highlighting challenges requiring collective attention, especially the transition from electrons to photons. Gain insights into how advanced packaging creativity integrates higher performance chips within smaller form factors for transformative latency improvement and bandwidth enhancement.
