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Learn about optical connectivity technologies essential for scaling AI xPUs beyond single rack configurations in this conference talk by Rang-Chen (Ryan) Yu, VP Marketing at TeraHop. Explore the economic drivers behind multi-rack AI compute cluster scaling and examine various low-power optical technologies including TRO (Tunable Receive Optics), LPO (Linear Pluggable Optics), NPO (Near Packaged Optics), and CPO (Co-Packaged Optics). Discover innovative approaches such as slow and wide technologies utilizing massive numbers of uLED channels modulated at low speeds to achieve low picojoule-per-bit energy efficiency. Analyze the advantages and disadvantages of each optical technology solution and identify the most promising candidates for next-generation multi-rack xPU scale-up applications in large AI computing environments.
