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Explore energy-efficient interconnect technologies driving the AI revolution in this 23-minute conference talk. Discover how advancing from 224G to 448G per lane boosts bandwidth while reducing power consumption in AI systems. Compare electrical and optical interconnect options including Linear Pluggable Optics (LPO), Near Packaged Optics (NPO), and Co-Packaged Optics (CPO) to understand their respective advantages and applications. Learn about innovative liquid-cooling solutions that address thermal challenges in high-performance computing environments. Examine cutting-edge 3.2 Tb/s modules and their role in enabling next-generation AI network architectures. Gain insights into the technical considerations and trade-offs involved in selecting optimal interconnect solutions for modern AI infrastructure, presented by a senior product management expert from the telecommunications industry.
