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Explore hardware reverse engineering techniques in this 54-minute conference talk from BSidesLV 2014. Delve into PCB construction and layer stack analysis, learn about laser-based methods for soldermask removal, controlled-depth skiving, and full PCB layer ablation. Discover the applications of acoustic microscopy in examining epoxy encapsulation, and gain insights into X-ray inspection techniques, including both 2D general PCB inspection and 3D/CT PCB layer extraction. Enhance your understanding of advanced hardware analysis methods and their practical applications in reverse engineering.
