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Learn about implementing thermal binning support in Linux kernel development through this 48-minute conference talk from the Linux Plumbers Conference. Explore how processors with identical designs can be packaged with different thermal junction (Tj) temperature thresholds by modifying packaging characteristics. Discover the introduction of a new device tree property similar to opp-supported-hw that enables support for varying thermal properties across different SoC variants. Gain insights into kernel thermal management strategies and understand how thermal binning allows manufacturers to optimize processor performance based on thermal capabilities while maintaining compatibility across different hardware configurations.
