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This conference talk explores advanced cooling solutions for AI and HPC workloads in data centers, presented by Ludwig Haber (VP of Advanced Projects at JETCOOL Technologies) and Eoghan Dillon (Senior Director for Strategy and Solution Design at Flex). Discover how JetCool, now fully integrated with Flex, delivers vertically integrated liquid cooling solutions that enable seamless AI infrastructure deployment at global scale. Learn about Flex's unique combination of advanced manufacturing capabilities, innovative power and cooling products, and lifecycle services. Explore the new SmartSense CDU technology launching at OCP EMEA, which supports 300kW per rack and up to 2.1MW in-row, effectively handling high power processors and warm inlet temperatures to maximize cooling efficiency. Understand the advantages of their best-in-class liquid cooling technology that delivers 25% better performance than microchannels and is specifically built for high-power processors, providing the most efficient direct-to-chip cooling available in the industry.
