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Learn about cutting-edge developments in packaging and assembly techniques essential for bringing neuromorphic photonic integrated circuits (PICs) to market in this 31-minute research presentation from the Instituto de Física Interdisciplinar y Sistemas Complejos (IFISC). Explore the technical challenges and innovative solutions in the commercialization process of neuromorphic PICs, focusing on advanced packaging methodologies and assembly techniques that bridge the gap between laboratory prototypes and commercially viable products.
