On Package Memory with Universal Chiplet Interconnect Express UCIe

Learn about on-package memory implementation using Universal Chiplet Interconnect Express (UCIe) technology in this 30-minute conference presentation from the Hot Interconnects Symposium. Explore the technical aspects of integrating memory directly onto chip packages through UCIe standards, presented by industry experts from Intel and AMD including Debendra Das Sharma, Swadesh Choudhary, Peter Onufryk, and Robert Pelt. Discover how UCIe enables efficient chiplet-to-chiplet communication and memory integration, understanding the architectural considerations, performance benefits, and implementation challenges of on-package memory solutions. Gain insights into the collaborative industry approach to standardizing chiplet interconnects and how this technology addresses modern computing demands for higher bandwidth and lower latency memory access.