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Learn about advanced power distribution solutions for next-generation data centers in this 15-minute conference talk featuring system architect Hal Loket from TE Connectivity and mechanical engineer Dmitriy Shapiro from Meta. Explore how liquid-cooled busbars enable significant increases in current carrying capacity and overall rack power to support the latest AI-ML workloads as OCP and the industry scale to higher power levels. Discover how incorporating liquid cooling technology into horizontal busbars enhances rack-to-rack connectivity in 48V ORv3 HPR sidecar architectures, ultimately reducing the number of connections and copper requirements for improved sustainability in data center infrastructure.
