Modularizing the Datacenter - A Layered Approach from HV to Compute and Cooling
Open Compute Project via YouTube
Overview
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Explore a comprehensive framework for datacenter modularization through a layered architectural approach in this 15-minute conference talk. Learn how to decompose datacenters into interoperable modules optimized for performance, deployment flexibility, and energy efficiency as demands evolve toward greater scalability and sustainability. Discover strategies for implementing low-performance compute modules that provide cost-effective capacity for latency-tolerant workloads. Examine thermal management as a first-class module, covering cooling and heat rejection strategies that align seamlessly with compute and power layers. Understand the critical role of software orchestration layers in binding these modules into cohesive, intelligent systems that enable dynamic provisioning, fault isolation, and energy-aware workload placement across the entire datacenter infrastructure.
Syllabus
Modularizing the Datacenter A Layered Approach from HV to Compute and Cooling
Taught by
Open Compute Project