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Learn about advanced Air-Assisted Liquid Cooling (AALC) solutions designed for high-performance AI data centers in this 13-minute conference talk from the Open Compute Project. Explore the evolution of AALC systems toward double and multi-rack-wide sidecars with large liquid-to-air heat exchangers to address the increasing thermal demands of modern AI chips. Discover a comprehensive design and validation framework that focuses on critical aspects including airflow optimization, pipe routing strategies, and serviceability considerations. Examine enhanced test metrics such as approach temperature, LPM-kW, and CFM-kW that provide more accurate real-world performance assessments compared to traditional P-Q curves. Understand how wide-format AALC implementations impact airflow management, aisle compatibility, and logistics planning. Gain insights into applying these design principles early in the development process to reduce integration risks, improve deployment efficiency, and generate valuable data for future cooling architecture designs in high-density AI computing environments.
