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Explore how Co-Packaged Optics (CPO) technology is revolutionizing AI networking infrastructure in this 17-minute conference talk from the Open Compute Project. Discover why traditional copper interconnects are becoming critical bottlenecks as data rates surge to 400Gbps and beyond, and learn how CPO solutions overcome these electrical constraints to enable seamless optical scaling for next-generation data centers. Examine Micas Networks' groundbreaking 51.2T Co-Packaged Optics switch system, developed in partnership with Broadcom, which represents an industry-first solution for AI-driven data centers requiring massive scalability. Understand the technical challenges driving the transition from copper to optical interconnects and gain insights into how CPO technology addresses performance limitations while supporting the relentless demands of modern AI workloads and high-speed networking applications.
