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Learn how die warpage significantly impacts thermal interface material (TIM) performance in real-world applications through this 16-minute conference talk from the Open Compute Project. Discover why conventional ASTM D5470 flat test platform measurements fail to predict actual system performance, with some TIMs showing tens of percent performance differences across platforms due to die surface variations. Explore research findings that reveal how initially concave dies tend to flatten during operation by analyzing ASIC and HBM junction temperatures relative to GPU temperature. Compare TIM performance results between H100 and ASTM D5470 setups to understand how die warpage creates major gaps between standard test data and real system behavior. Examine the limitations of conventional thermal test vehicles (TTVs) and validation methods that don't reflect in-system conditions. Gain insights into a new evaluation approach that identifies warpage change direction, enabling more accurate TIM selection and performance prediction for practical applications in high-performance computing systems.
