How to Select and Place ESD Components to Protect Your Boards

Learn how to effectively select and place Electrostatic Discharge (ESD) components to protect your printed circuit boards (PCBs) in this comprehensive video tutorial. Explore the fundamentals of ESD protection, including chip-level vs. board-level protection, ESD standards, and various testing methods. Discover key factors in choosing the right ESD protection components, such as capacitance, protection voltage, and reverse standoff voltage. Examine optimal placement strategies for ESD protection and compare different approaches through simulations. Delve into advanced topics like signal integrity, time domain reflectometry, and S-parameters. Gain insights into modern snap-back ESD protection, on-chip vs. external ESD protection, and techniques for identifying specific ESD protection components for your designs.

Syllabus

What this video is about
Chip level vs. board level ESD protection
Is 8kV ESD protection enough?
Human Body Model
System Level ESD Standards
ESD tests
Direct discharge
Indirect discharge
Air discharge
How to choose the correct ESD protection component
Capacitance vs. datarate
Protection voltage
Reverse standoff voltage, breakdown, clamping, trigger, holding
Snap back vs. Zener
Where to place ESD protection
Comparing 3 different ESD protection placements
Simulating ESD event and protection
ESD event vs. data transmission simulations
Signal integrity simulations with ESD
Time domain reflectometry TDR in ESD simulations
ESD protection vs. eye diagrams vs. package
ESD damage on the chip
Modern snap-back ESD protection
S-parameters
External ESD vs. on-chip ESD
How to find a specific ESD protection component