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This presentation by Anthony Mastroianni, Siemens EDA's Advanced Packaging Solutions Director, explores how heterogeneous integration and 3D IC technologies are becoming essential in mainstream design. Discover how the combination of new design and manufacturing technologies with evolving product demands from system integrators is transforming the industry. Learn about the unique challenges of 3D IC implementation, which goes beyond traditional packaging solutions to create complex multiphysics integration considerations involving thermal, mechanical, reliability, test, and core semiconductor design aspects. Understand how the Open Compute Project's 3D IC Design Kits (3DK) initiatives are creating new design enablement frameworks to support the heterogeneous supply chain and facilitate true open ecosystem collaboration in the 3D IC codesign process.
