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Learn about cutting-edge power and liquid cooling innovations designed to support next-generation AI data centers requiring over 1MW per IT rack in this 12-minute conference talk. Explore how high-voltage direct current (HVDC) power distribution systems combine with modular power components to deliver 1.2MW capacity in ORv3 standard racks, including detailed coverage of AC and DC power distribution units, power shelves, and energy storage shelves. Discover how end-of-rack coolant distribution units (CDU) manage thermal loads by controlling flow and return across multiple nodes, enabling rack-level thermal design capacities exceeding 2MW. Understand the integration of these power and cooling solutions to achieve efficient, scalable delivery of high current with reduced losses while redefining the thermal-electrical envelope for AI-optimized infrastructure. Gain insights into open systems approaches for AI workloads as presented by industry experts from Flex's product line management team at the Open Compute Project.
