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거대 연산망 구현을 위한 CPO 기반 차세대 연결 기술로의 진화

SK AI SUMMIT 2024 via YouTube

Overview

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Explore the evolution of next-generation connection technologies based on Co-Packaged Optics (CPO) for implementing massive computational networks in this 21-minute conference talk from SK AI SUMMIT 2024. Discover how while chip-level advanced collaborative structures are being established, the physical connection structures of AI systems still act as performance limiting factors, particularly as existing electrical interconnects have structural constraints in terms of bandwidth and energy efficiency in large-scale computational network environments. Learn about CPO technology as an alternative to overcome these limitations and as a paradigm-shifting technology for connecting and expanding computing resources in the AI era. Understand the background of CPO technology's emergence, its core value, and its potential to lead AI infrastructure innovation through insights from Professor Lee Kyu-sang of the University of Virginia, who conducts active research in future neuromorphic computing and silicon photonics fields and provides a leading perspective on the evolution direction and feasibility of CPO technology for large-scale AI systems.

Syllabus

거대 연산망 구현을 위한 CPO 기반 차세대 연결 기술로의 진화 | SK하이닉스 이규상

Taught by

SK AI SUMMIT 2024

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