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Learn integrated circuit reverse engineering fundamentals through safe decapping, delayering, imaging, and analysis techniques in this 46-minute conference talk. Discover how to safely remove IC packaging and layers using minimal equipment that can be used at home with proper ventilation. Master essential beginner tools and techniques for capturing high-quality chip images and analyzing semiconductor structures. Explore practical examples from the Siliconpr0n community while gaining insights into current reverse engineering projects. Understand the step-by-step process of peeling back IC layers to uncover chip secrets, from initial decapping through detailed structural analysis, all while maintaining safety protocols to avoid the mishaps and risky experiments that often plague newcomers to this field.
