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Watch a 17-minute conference talk exploring how SCINTIL Photonics addresses the exponential growth of AI computing demands through advanced optical interconnect solutions. Learn about heterogeneous integration of III-V materials with silicon photonics to create photonic integrated circuits (PICs) featuring monolithically integrated DFB lasers and SOA. Discover how this innovative technology enables higher data throughput and lower power consumption in data centers and HPC clusters through CWDM4 transmitters for Pluggable Optics and DWDM external laser sources for Co-Packaged Optics. Gain insights into how parallelism and optical interconnects are becoming crucial for meeting the escalating demands of AI/ML applications.
