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Explore the critical physical infrastructure foundations that enable scalable AI workloads in this comprehensive webinar examining interconnect technologies and storage solutions. Discover how evolving AI demands require advanced performance, reliability, and efficiency from data-intensive applications, with particular focus on the form factors, connectors, cables, and transceivers standards that make scalable and interoperable systems possible. Learn about SNIA's SFF Technical Work Group contributions to developing physical layer standards supporting high-performance interconnects and storage devices in AI environments. Examine transceiver innovation requirements, the role of form factors like EDSFF, and how innovative cabling and connector designs facilitate adoption of high-speed signaling technologies including PCIe 8.0 and beyond. Gain insights into transceiver development for out-of-box signaling, connectors and cables for high-speed inbox signaling, copper versus optical challenges, and SSD form factor innovations impacting density and thermal design. Presented by industry experts Anthony Constantine from Micron Technology, Tom Palkert from Samtec, and Erik Smith from Dell Technologies, this session targets architects, engineers, and technologists seeking to understand how physical infrastructure standards enable next-generation AI systems.
