This course is designed to provide a comprehensive understanding of heat generation, dissipation, and control in modern electronic systems. It begins with a refresher on heat transfer fundamentals and progresses through passive and active cooling techniques, including cutting-edge solutions like two-phase cooling and additive-manufactured heat sinks. With real-world case studies and applications spanning consumer devices to power electronics and data centers, the course equips learners with the tools to design thermally efficient and reliable electronic systems.
INTENDED AUDIENCE: Industry professionals (semiconductor packaging , electric vehicles), UG/PG students from educational institutes
PREREQUISITES: Thermodynamics, Fluid Mechanics, Heat Transfer
INDUSTRY SUPPORT: • Industry on thermal management
• Industry of electronics packaging