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Explore TCAD and EDA Workflows

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Overview

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From chip architecture to timing closure, semiconductor design depends on simulation. CAE, TCAD, and EDA are three interconnected stages, each answering a specific design question. This course walks you through the workflow: how process recipes feed device simulations, which generate compact models for circuit timing analysis. You'll learn to interpret simulation outputs across process-voltage-temperature corners, understand why margins matter, and recognize where process changes cascade to timing risk. Whether you're supporting a design team, managing process technology, or advancing your semiconductor foundations, this course demystifies the simulation ecosystem. By the end of this course, you will be able to: - Differentiate CAE, TCAD, and EDA stages by describing the design questions each answers - Trace the data flow from process recipe through TCAD to SPICE circuit verification - Interpret simulation outputs to explain how process changes affect circuit delay across corner models Basic semiconductor physics (transistor structure, doping) and familiarity with circuit concepts (voltage, current). No CAD tool experience required: every activity supplies pre-run simulation output for interpretation rather than asking learners to operate a simulator.

Syllabus

  • Simulation Stages: CAE, TCAD, and EDA in the Semiconductor Lifecycle
    • Understand how CAE, TCAD, and EDA fit into the semiconductor product lifecycle and what design question each stage answers.
  • From Process Recipe to Compact Model: The TCAD Workflow
    • Trace how TCAD simulations convert process recipes and device physics into SPICE compact models, bridging process design to circuit verification.
  • Corners and Design Margins: Interpreting Simulation Results
    • Interpret SPICE simulation outputs across process-voltage-temperature corners to understand how manufacturing variation and process shifts affect circuit timing.

Taught by

Professionals in the Industry and Ritesh Vajariya

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