Finding the Needle in the Haystack - On the Use of AI in Defect Analysis
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Learn about the application of artificial intelligence in semiconductor defect analysis through this 38-minute technical presentation from MEPTEC that explores innovative approaches to identifying and analyzing defects in semiconductor manufacturing, demonstrating how AI technologies can efficiently locate and classify anomalies in what is often compared to finding a needle in a haystack.
Syllabus
Finding the Needle in the Haystack - on the Use of AI in Defect Analysis
Taught by
MEPTEC